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| INTEGRATED CIRCUITS DATA SHEET TDA7053 2 x 1 W portable/mains-fed stereo power amplifier Product specification File under Integrated Circuits, IC01 February 1994 Philips Semiconductors Product specification 2 x 1 W portable/mains-fed stereo power amplifier GENERAL DESCRIPTION TDA7053 The TDA7053 is an integrated class-B stereo power amplifier in a 16-lead dual-in-line (DIL) plastic package. The device, consisting of two BTL amplifiers, is primarily developed for portable audio applications but may also be used in mains-fed applications. Features * No external components * No switch-ON/OFF clicks * Good overall stability * Low power consumption * Short-circuit-proof. QUICK REFERENCE DATA PARAMETER Supply voltage range Total quiescent current Output power Internal voltage gain Total harmonic distortion PO = 0.1 W RL = RL = 8 ; VP = 6 V PO Gv THD - 38 - 1.2 39 0.2 - 40 1.0 W dB % CONDITIONS VP Itot SYMBOL 3 - MIN. 6 9 TYP. MAX. 18 16 V mA UNIT PACKAGE OUTLINE 16-lead DIL; plastic (SOT38); SOT38-1; 1996 July 24. February 1994 2 Philips Semiconductors Product specification 2 x 1 W portable/mains-fed stereo power amplifier TDA7053 Fig.1 Block diagram. February 1994 3 Philips Semiconductors Product specification 2 x 1 W portable/mains-fed stereo power amplifier PINNING 1. 2. 3. 4. 5. 6. 7. 8. Note SGND1 IN1 n.c. n.c. VP IN2 SGND2 n.c. signal ground 1 input 1 not connected not connected supply voltage input 2 signal ground 2 not connected 9. OUT2A 10. GND2 11. n.c. 12. OUT2B 13. OUT1B 14. GND1 15. n.c. 16. OUT1A output 2 (positive) power ground 2 not connected output 2 (negative) output 1 (negative) power ground 1 not connected output 1 (positive) TDA7053 The information contained within the parentheses refer to the polarity of the loudspeaker terminal to which the output must be connected. FUNCTIONAL DESCRIPTION The TDA7053 is a stereo output amplifier, with an internal gain of 39 dB, which is primarily for use in portable audio applications but may also be used in mains-fed applications. The current trends in portable audio application design is to reduce the number of batteries which results in a reduction of output power when using conventional output stages. The TDA7053 overcomes this problem by using the Bridge-Tied-Load (BTL) principle and is capable of delivering 1.2 W into an 8 load (VP = 6 V). The load can be short-circuited under all input conditions. February 1994 4 Philips Semiconductors Product specification 2 x 1 W portable/mains-fed stereo power amplifier RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage Non-repetitive peak output current Total power dissipation Crystal temperature Storage temperature range CONDITIONS VP IOSM Ptot Tc Tstg - -55 SYMBOL - - MIN. 18 1.5 see Fig.2 + 150 + 150 TDA7053 MAX. V A C C UNIT THERMAL RESISTANCE From junction to ambient Power dissipation Assuming: VP = 6 V and RL = 8 : The maximum sinewave dissipation is 1.8 W, therefore Tamb(max.) = 150 - (50 x 1.8) = 60 C. Rth j-a 50 K/W Fig.2 Power derating curve. February 1994 5 Philips Semiconductors Product specification 2 x 1 W portable/mains-fed stereo power amplifier CHARACTERISTICS VP = 6 V; RL = 8 ; Tamb = 25 C; unless otherwise specified; measured from test circuit, Fig.7. PARAMETER Supply voltage range Total quiescent current Input bias current Supply voltage ripple rejection note 2 Input impedance DC output offset voltage Noise output voltage (RMS value) Output power Total harmonic distortion Internal voltage gain Channel balance Channel separation Frequency response Notes to the characteristics 1. With a practical load the total quiescent current depends on the offset voltage. note 3 note 4 note 5 THD = 10% PO = 0.1 W Vno(rms) Vno(rms) PO THD Gv Gv f - - - - 38 - 40 - 150 60 1.2 0.2 39 - - 0.02 to 20 300 - - 1.0 40 1 - - note 3 RL = ; note 1 CONDITIONS SYMBOL VP Itot Ibias SVRR ZI V13-16 V12-9 3 - - 40 - - - MIN. 6 9 100 50 100 - - TYP. 18 16 300 - - 100 100 MAX. TDA7053 UNIT V mA nA dB k mV mV V V W % dB dB dB kHz 2. Ripple rejection measured at the output with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage (200 mV) is applied to the positive supply rail. 3. RS = 5 k. 4. The noise output voltage (RMS value) is measured with RS = 5 k, unweighted and a bandwidth of 60 Hz to 15 kHz. 5. The noise output voltage (RMS value) is measured with RS = 0 and f = 500 kHz with 5 kHz bandwidth. If RL = 8 and LL = 200 H the noise output current is only 100 nA. February 1994 6 Philips Semiconductors Product specification 2 x 1 W portable/mains-fed stereo power amplifier APPLICATION INFORMATION TDA7053 Fig.3 Quiescent current as a function of voltage supply (VP); Tamb = 60 C. Fig.4 Output power as a function of voltage supply (VP); THD = 10%; f = 1 kHz; Tamb = 60 C. February 1994 7 Philips Semiconductors Product specification 2 x 1 W portable/mains-fed stereo power amplifier TDA7053 Fig.5 Power dissipation as a function of output power; f = 1 kHz; Tamb = 60 C. Fig.6 Total harmonic distortion as a function of output power; f = 1 kHz; Tamb = 60 C. February 1994 8 Philips Semiconductors Product specification 2 x 1 W portable/mains-fed stereo power amplifier TDA7053 Fig.7 Test and application circuit diagram. February 1994 9 Philips Semiconductors Product specification 2 x 1 W portable/mains-fed stereo power amplifier TDA7053 Fig.8 Printed-circuit board, track side. Fig.9 Printed-circuit board, component side. February 1994 10 Philips Semiconductors Product specification 2 x 1 W portable/mains-fed stereo power amplifier PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil); long body TDA7053 SOT38-1 D seating plane ME A2 A L A1 c Z e b1 b 16 9 MH wM (e 1) pin 1 index E 1 8 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 February 1994 11 Philips Semiconductors Product specification 2 x 1 W portable/mains-fed stereo power amplifier SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values TDA7053 The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. February 1994 12 |
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